Publications
Journal Publications
[52] A. C. Chavez, J. D. Schneider, A. Barra, S. Tiwari, R. N. Candler, and G. P. Carman, “Voltage-Controlled Ferromagnetic Resonance of Dipole-Coupled CoFeB Nanoellipses,” Physical Review Applied, 2019.
[51] Y.-C. Hsiao, R. Khojah, X. Li, A. Kundu, C. Chen, D. B. Gopman, A. C. Chavez, T. Lee, Z. Xiao, A. E. Sepulveda, R. N. Candler, G. P. Carman, D. Di Carlo, and C. S. Lynch, “Capturing Magnetic Bead-based Arrays Using Perpendicular Magnetic Anisotropy, Applied Physics Letters, Vol. 115, Issue 8 (2019).
[50] (Invited Review) S. Tiwari and R. Candler, "Using flexural MEMS to study and exploit nonlinearities: a review." Journal of Micromechanics and Microengineering (2019).
[49] Y. Dai, A. Abiri, J. Pensa, S. Liu, O. Paydar, H. Sohn, S. Sun, P. A. Pellionisz, C. Pensa, E. P. Dutson, W. S. Grundfest and R. N. Candler, “Biaxial sensing suture breakage warning system for robotic surgery” Biomedical Microdevices, vol. 21, issue 10, 2019.
[48] L. Li, A. Maccabi, A. Abiri, Y.-Y. Juo, W. Zhang, Y.-J. Chang, G. Saddik, L. Jin, W. Grundfest, E. Dutson, J. Eldredge, P. Benharash, R. N. Candler, “Characterization of Perfused & Sectioned Liver Tissue In A Full Indentation Cycle Using A Visco-hyperelastic Model,”Journal of the Mechanical Behavior of Biomedical Materials, 2018.
[47] Z. Xiao, R. Khojah, M. Chooljian, R. Lo Conte, J. Schneider, K. Fitzell, R. Chopdekar, Y. Wang, A. Scholl, J. Chang, G. Carman, J. Bokor, D. Di Carlo, R. Candler, “Cytocompatible magnetostrictive microstructures for nano- and microparticle manipulation on linear strain response piezoelectrics,” Multifunctional Materials, 1 (1), 014004, 2018.
[46] A. Abiri, S. J. Askari, A. Tao, Y. Juo, Y. Dai, J. Pensa, R. Candler, E. Dutson and W. Grundfest, “Suture Breakage Warning System for Robotic Surgery,” IEEE Transactions on Biomedical Engineering, 2018.
[45] Z. Xiao, R. Lo Conte, C. Chen, C.-Y. Liang, J. Bokor, G. P. Carman, R. N. Candler “Bi-directional coupling in strain-mediated multiferroic heterostructures with magnetic domains and domain wall motion” Scientific Reports, Vol. 8, (2018) doi:10.1038/s41598-018-23020-2 (link)
[44] R. Lo Conte, Z. Xiao, C. Chen, C. Stan, J. Gorchon, A. El-Ghazaly, M. Nowakowski, H. Sohn, P. Akshay, A. Scholl, T. Nobumichi, A. Sepulveda, G. Carman, R. N. Candler, J. Bokor “Influence of Non-Uniform Micron-Scale Strain Distributions on the Electrical Reorientation of Magnetic Micro-Structures in a Composite Multiferroic Heterostructure", Nano Letters, 2018, DOI: 10.1021/acs.nanolett.7b05342
[43] Z. Xiao, K. P. Mohanchandra, R. Lo Conte, T. Karaba, J. D. Schneider, A. Chavez, S. Tiwari, H. Sohn, M. E. Nowakowski, A. Scholl, S. H. Tolbert, J. Bokor, G. P. Carman, and R. N. Candler, “Enhanced magnetoelectric coupling in a composite multiferroic system via interposing a thin film polymer,” AIP Advances 8, 055907 (2018).
[42] Y. Hwang and R. N. Candler, “Non-planar PDMS microfluidic channels and actuators: a review,” Lab on a Chip, 17, 3948 - 3959, 2017.
[41] Hyunmin Sohn, Cheng-yen Liang, Mark E. Nowakowski, Yongha Hwang, Seungoh Han, Jeffrey Bokor, Gregory P. Carman, Robert N. Candler, “Deterministic multi-step rotation of magnetic single-domain state in Nickel nanodisks using multiferroic magnetoelastic coupling”, Journal of Magnetism and Magnetic Materials, vol 439, pp. 196-202, 2017.
[40] I. Gadjev, R. Candler, C. Emma, J. Harrison, A. Nause, J. Wu, A. Gover, and J. Rosenzweig. "High-GaiN, Short Wavelength FEL in The Raman REGIME." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment (2017).
[39] A. Abiri, O. Paydar, A. Tao, M. LaRocca, K. Liu, B. Genovese, R. Candler, W. S. Grundfest, E. P. Dutson, “Tensile strength and failure load of sutures for robotic surgery”, Surg Endosc, doi:10.1007/s00464-016-5356-1, 2016.
[38] Y. Hwang, D. Seo, M. Roy, E. Han, R. N. Candler and S. Seo, "Capillary Flow in PDMS Cylindrical Microfluidic Channel Using 3-D Printed Mold," in Journal of Microelectromechanical Systems, vol. 25, no. 2, pp. 238-240, April 2016.
[37] Srikanth Iyer and Rob N. Candler, “Mode- and direction-dependent mechanical energy dissipation in single-crystal resonators due to anharmonic phonon-phonon scattering”, Physical Review Applied, 2016.
[36] Yongha Hwang, Omeed H. Paydar, Robert N. Candler, “Pneumatic microfinger with balloon fins for linear motion using 3D printed molds,” Sensors and Actuators A: Physical, 2015.
[35] H. Sohn, M. E. Nowakowski, C.-Y. Liang, J. L. Hockel, K. Wetzlar, S. Keller, B. M. McLellan, M. A. Marcus, A. Doran, A. Young, M. Kläui, G. P. Carman, J. Bokor, R. N. Candler, “Electrically Driven Magnetic Domain Wall Rotation in Multiferroic Heterostructures to Manipulate Suspended On-Chip Magnetic Particles”, ACS Nano, 9 (5), pp 4814–4826, 2015.
[34] Y. Hwang, O. Paydar, R. N. Candler, “3D printed molds for non-planar PDMS microfluidic channels,” Sensors and Actuators A, 226, 137-142, 2015.
[33] J. Harrison, Y. Hwang, O. Paydar, J. Wu, E. Threlkeld, J. Rosenzweig, P. Musumeci, R. N. Candler, “High-gradient microelectromechanical system quadrupole electromagnets for particle beam focusing and steering,” Physical Review Special Topics on Accelerators and Beams, 18, 023501, 2015.
[32] Y. Hwang, O.H. Paydar, M. Ho, J. B. Rosenzweig, and R. N. Candler, “Electrochemical macroporous silicon etching with current compensation,” IET Electronics Letters, vol. 50, no. 19, pp. 1373-1375, September 11 2014.
[31] J. Harrison, O. H. Paydar, Y. Hwang, J. Wu, E. Threlkeld, J. Rosenzweig, P. Musumeci, R. N. Candler, “Fabrication Process for thick film micromachined multi-pole electromagnets”, JMEMS Letter, Vol. 23, No. 3, 2014.
[30] O. H. Paydar, C. N. Paredes, Y. Hwang, J. Paz, N. B. Shah, R. N. Candler, “Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings,” Sensors and Actuators A, 205, 199–203, 2014.
[29] Y. Hwang, H. Sohn, A. Phan, O. M. Yaghi, R. N. Candler, “Dielectrophoresis-Assembled Zeolitic Imidazolate Framework Nanoparticle-Coupled Resonators for Highly Sensitive and Selective Gas Detection,” Nanoletters, 13 (11), pp. 5271-5276, 2013
[28] Y. Hwang, A. Phan, K. Galatsis, O. M. Yaghi, R. N. Candler, “Zeolitic imidazolate framework-coupled resonators for enhanced gas detection”, Journal of Micromechanics and Microengineering, Vol. 23, Issue 12, 2013.
[27] J. Lake, A. Duwel, R. N. Candler, “Particle Swarm Optimization for Design of Slotted MEMS Resonators with Low Thermoelastic Dissipation”, Journal of Microelectromechanical Systems, Vol. 23, Issue 2, pp. 364-371, 2013.
[26] S. S. Iyer, R. Vedad-Ghavami, H. Lee, M. Liger, H. P. Kavehpour, and R. N. Candler, “Nonlinear damping for vibration isolation of microsystems using shear thickening fluid”, Appl. Phys. Lett. 102, 251902 (2013).
[25] Y. Hwang and R. N. Candler, “Fabrication Process for Integrating Nanoparticles with Released Structures Using Photoresist Replacement of Sublimated p-dichlorobenzene for Temporary Support”, JMEMS, Vol. 21, Issue 6, pp. 1282-1284, 2012.
[24] J. Harrison, A. Joshi, J. Lake, R. N. Candler, P. Musumeci, “Surface-micromachined magnetic undulator with period length between 10 μm and 1 mm for advanced light sources,” Physical Review Special Topics on Accelerators and Beams, vol. 15, issue 7, pp. 070703, 2012.
[23] Y. Hwang, F. Gao, A. J. Hong, R. N. Candler, “Porous Silicon Resonators for Improved Vapor Detection,” Journal of Microelectromechanical Systems, vol. 21, issue 1, pp. 235-242, 2012.
[22] S. M. Kim, E. B. Song, S. Lee, S. Seo, D. H. Seo, Y. Hwang, R. N. Candler, and K. Wang, "Suspended few-layer graphene beam electromechanical switch with abrupt on-off characteristics and minimal leakage current," Applied Physics Letters, vol. 99, p. 023103, 2011.
[21] J. Kim, A. J. Hong, S. M. Kim, K.-S. Shin, E. B. Song, Y. Hwang, F. Xiu, K. Galatsis, C. O. Chui, R. N. Candler, S. Choi, J.-T. Moon, and K. W. Wang, "A stacked memory device on logic 3D technology for ultra-high-density data storage," Nanotechnology, vol. 22, p. 254006, 2011.
[20] R. N. Candler, “Etiquette for Engineers: Tips for Getting a Great Letter of Recommendation,” IEEE Potentials, Vol 30, no. 4, pp. 14-16, 2011.
[19] Tsai, K. L., Ziaei-Moayyed, M., Candler, R. N., Hu, W., Brand, V., Klejwa, N., Wang, S., Howe, R. T., "Magnetic, Mechanical, and Optical Characterization of a Magnetic Nanoparticle-Embedded Polymer for Microactuation," Journal of Microelectromechanical Systems, vol. 20, no. 1, pp. 65-72, 2010.
[18] S. Yoneoka, C. S. Roper, R. N. Candler, S. A. Chandorkar, A. B. Graham, J. Provine, R. Maboudian, R. T. Howe, and T. W. Kenny, "Characterization of Encapsulated Micromechanical Resonators Sealed and Coated With Polycrystalline SiC," Journal of Microelectromechanical Systems, vol. 19, no. 2, pp. 357-366, 2010.
[17] G. Bahl, R. Melamud, B. Kim, S. A. Chandorkar, J. C. Salvia, M. A. Hopcroft, D. Elata, R. G. Hennessy, R. N. Candler, R. T. Howe, T. W. Kenny, "Model and Observations of Dielectric Charge in Thermally Oxidized Silicon Resonators, " Journal of Microelectromechanical Systems, vol. 19, no. 1, pp. 162-174, 2010.
[16] S. A. Chandorkar, R. N. Candler, A. Duwel, R. Melamud, M. Agarwal, K. E. Goodson, and T. W. Kenny, "Multimode thermoelastic dissipation," Journal of Applied Physics, vol. 105, p. 043505, 2009.
[15] B. Kim, R. N. Candler, R. Melamud, M. A. Hopcroft, S. Yoneoka, H. K. Lee, G. Yama, T. W. Kenny, “Hermeticity and Diffusion Investigation in Polysilicon Film Encapsulation for Microelectromechanical Systems (MEMS),” Journal of Applied Physics. 105, 013514, 2009.
[14] B. Kim, M. A. Hopcroft, R. N. Candler, C. M. Jha, M. Agarwal, R. Melamud, S.A. Chandorkar, G. Yama, T. W. Kenny, "Temperature Dependence of Quality Factor in MEMS Resonators", Journal of Microelectromechanical Systems," Volume 17, No. 3, pp. 755-766, 2008.
[13] M. Agarwal, H. Mehta, R. N. Candler, S. Chandorkar, B. Kim, M. A. Hopcroft, R. Melamud, G. Bahl, G. Yama, T. W. Kenny and B. Murmann, “Scaling of amplitude-frequency-dependence nonlinearities in electrostatically transduced microresonators,” Journal of Applied Physics, vol. 102, 074903, 2007.
[12] C. M. Jha, M. A. Hopcroft, S. A. Chandorkar, J. Salvia, M. Agarwal, R. N. Candler, R. Melamud, B. Kim, and T. W. Kenny, “Thermal Isolation of Encapsulated MEMS Resonators,” Journal of Microelectromechanical Systems, Vol. 17, No. 1, pp. 175-184, 2007.
[11] M.A. Hopcroft, B. Kim, S. Chandorkar, R. Melamud, M. Agarwal, C.M. Jha, G. Bahl, J. Salvia, H. Mehta, H. K. Lee, R.N. Candler, T.W. Kenny, “Using the Temperature Dependence of Resonator Quality Factor as a Thermometer,” Applied Physics Letters, vol. 91, 013505, 2007.
[10] W.-T. Park, K. N. O’Connor, K.-L. Chen, J. R. Mallon, T. Maetani, P. Dalal, R. N. Candler, V. Ayanoor-Vitikkate, J. B. Roberson, S. Puria, T. W. Kenny, “Ultraminiature Encapsulated Accelerometers as a Fully Implantable Sensor for Implantable Hearing Aids,” Journal of Biomedical Microdevices, vol. 9, no. 6, pp. 939-949, 2007.
[9] B. Kim, R. N. Candler, M. A. Hopcroft, M. Agarwal, W.-T. Park, T. W. Kenny, “Frequency Stability of Wafer-scale Encapsulated Silicon Based MEMS Resonators,” Sensors and Actuators, A: Physical, vol. 136, pp. 125-131, 2007.
[8] M. Agarwal, K. K. Park, S. A. Chandorkar, R. N. Candler, B. Kim, M. A. Hopcroft, R. Melamud, T. W. Kenny, and B. Murmann, “Acceleration Sensitivity in Beam-type Electrostatic Microresonators,” Applied Physics Letters, vol. 90, no. 1, 014103, 2007.
[7] M. Agarwal, S. A. Chandorkar, R. N. Candler, B. Kim, M. A. Hopcroft, R. Melamud, C. M. Jha, D. B. Leeson, T. W. Kenny, B. Murmann, “Optimal Drive Condition for Nonlinearity Reduction in Electrostatic MEMS resonators,” Applied Physics Letters, vol. 89, no. 21, pp. 4105-07, 2006.
[6] R. N. Candler, M. Hopcroft, B. Kim, W.-T. Park, R. Melamud, M. Agarwal, G. Yama, A. Partridge, M. Lutz, T. W. Kenny, “Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators,” Journal of Microelectromechanical Systems, Vol. 15, pp. 1446-1456, 2006.
[5] R. N. Candler, A. Duwel, M. Varghese, S. A. Chandorkar, M. Hopcroft, W.-T. Park, B. Kim, G. Yama, A. Partridge, M. Lutz, and T. W. Kenny, “Impact of Geometry on Thermoelastic Dissipation in Micromechanical Resonant Beams,” Journal of Microelectromechanical Systems, Vol. 15, pp. 927-934, 2006.
[4] A. Duwel, R. N. Candler, T. W. Kenny, and M. Varghese, “Engineering MEMS Resonators with Low Thermoelastic Damping,” Journal of Microelectromechanical Systems, Vol. 15, pp. 1437-1445, 2006.
[3] W.-T. Park, A. Partridge, R. N. Candler, V. Ayanoor-Vitikkate, G. Yama, M. Lutz, and T. W. Kenny, “Encapsulated Submillimeter Piezoresistive Accelerometers,” Journal of Microelectromechanical Systems, Vol. 15, pp. 507-514, 2006.
[2] R. N. Candler, “Stuff Most Students Never Ask About Grad School,” IEEE Potentials, vol. 24, pp. 4-10, 2005.
[1] R. N. Candler, W.-T. Park, H. Li, G. Yama, A. Partridge, M. Lutz, and T. W. Kenny, “Single Wafer Encapsulation of MEMS Devices,” IEEE Transactions on Advanced Packaging, vol. 26, pp. 227-232, 2003.
Conference Publications
[75] R. Candler (Invited), “Microscale 3D Electromagnets for Next Generation Free Electron Lasers – Progress and Challenges, CLEO, 2019 (no proceedings).
[74] Z. Xiao, R. Khojah, M.K. Panduranga, M. Goiriena-Goikoetxea, R.V. Chopdekar, A. N’Diaye, R. Lo Conte, E. Arenholz, J.Bokor, G. P. Carman, D. Di Carlo and R. N. Candler, "Single Domain Magnetoelastic Terfenol-D Microdisks for Particle and Cell Manipulation", Joint Intermag-MMM Conference, 2019 (no proceedings) (Best student presentation award)
[73] Z. Xiao, R. Lo Conte, M. Goiriena, R. V. Chopdekar, X. Li, S. Tiwari, C.-H. Lambert, S. Salahuddin, G. P. Carman, K. Wang, J. Bokor and Rob N. Candler, "Electric-field controlled magnetic reorientation in exchange coupled CoFeB/Ni bilayer microstructures", PowerMEMS Conference (The 18th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications), IOP Conference Series, 2018. (Best paper finalist)
[72] (Invited) Influence of Micron-scale strain distributions on the electrical reorientation of magnetization in a composite multiferroic system", R. Lo Conte, Z. Xiao, C.V. Stan, J. Gorchon, A. El-Ghazaly, M. Nowakowski, H. Sohn, A. Pattabi, A. Scholl, N. Tamura, A. Sepulveda, G. Carman, R. N. Candler, J. Bokor,
[71] (Invited, No Proceedings) R. Candler, “Magnetic Microsystems for Communications”, AVS 65, 2018.
[70] L. Li, R. McGuan, P. Kavehpour, and R. N. Candler, "Precision Enhancement of 3D Printing via in situ Metrology," in 29th Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, 2018, p. In Press.
[69] Y. Dai, S. Liu, O. Paydar, A. Abiri, A. Tao, S. Sun, E. P. Dutson, W. S. Grundfest, R. N. Candler, “Miniature High Resolution Multi-Axis Force Sensor for Haptic Robotic Surgery”, The 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’18), 2018
[68] G.D. Vukasin, J. Rodriguez, L. Comenencia Ortiz, G.M. Glaze, D.D. Gerrard, C.H. Ahn, Y. Yang, J. Lake, R.N. Candler, and T.W. Kenny, Direct Measurements of Anchor Damping in Pressure-Limited Ring Resonators,” Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2018.
[67] S. Tiwari, M. Ho, A. Marotto, R. N. Candler, “Frequency Doubling in Wirelessly Actuated Multiferroic MEMS Cantilevers,” IEEE International Frequency Control Symposium, 2018.
[66] R.-F Xu, S. Tiwari, R. N. Candler, S.-Y. Chen, “Polarization Control of Bulk Acoustic Wave-Mediated Multiferroic Antennas Based on Thickness Shear Modes, “12th European Conference on Antennas and Propagation,” 2018.
[65] Y. Dai, A. Abiri, S. Liu, O. Paydar, H. Sohn, E. P. Dutson, W. S. Grundfest, and R.N. Candler, “Grasper Integrated Tactile Capacitive Sensing Unit for Minimally Invasive Surgery” The 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’17), 2017.
[64] J. Wu, L. Li, J. C. Harrison, R. N. Candler, “Micro-to millimeter scale magnetic shielding,” 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017.
[63] Z. Xiao, M.K. Panduranga, R. Lo Conte, H. Sohn, J. Bokor, G. Carman, and R.N. Candler “Enhancement of coupling efficiency of ferroelectric to magnetoelastic thin film via interposing thin film polymer,” Annual Conference on Magnetism and Magnetic Materials (MMM), (no proceedings), 2017.
[62] Z. Xiao, C. Liang, G. Carman and R.N. Candler, “Modeling of domain wall motion in multiferroic heterostructures”, Annual Conference on Magnetism and Magnetic Materials (MMM), (no proceedings), 2016.
[61] Y. Dai, O. Paydar, A. Abiri, Z. Xiao, X. Guan, E. P. Dutson, W. S. Grundfest, R. N. Candler, “Miniature Multi-axis Force Sensor for Haptic Feedback System in Robotic Surgery,” The 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’16), 2016.
[60] A. Abiri, X. Guan, Y. Dai, A. Tao, Z. Xiao, E. P. Dutson, R. N. Candler, W. S. Grundfest, “Depressed-Membrane Pneumatic Actuators for Robotic Surgery,” The 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’16), 2016.
[59] S. Tiwari, P. Nordeen, Q. Xu, Z. Yao, Y. E. Wang, G. P. Carman, R. N. Candler,”Ferromagetic Resonance in Bulk-Acoustic Wave Multiferroic Devices,” Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2016.
[58] S. Iyer and R. N. Candler, “Mode- and Direction-Dependent Akhiezer Damping in Single-Crystal Silicon Resonators,” Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2016.
[57] (Invited, no proceedings) R. N. Candler, “Micromachined Electromagnets: Pathway Toward a Miniature Free Electron Laser,” High Brightness Electron Beams, 2016.
[56] (Invited, no proceedings) H. Sohn, M. E. Nowakowski, C.-Y. Liang, S. M. Keller, C. S. Lynch, G. P. Carman, J. Bokor, and Rob N. Candler, “TANMS Magnetization Control in Multiferroic Ring Structures”, XXIII International Materials Research Congress, 2015.
[55] (Invited, no proceedings) Y. Hwang and R. N. Candler, “ZIF-coupled Resonant Sensors”, 2015 Joint Conference of the IEEE International Frequency Control Symposium & European Frequency and Time Forum”, 2015.
[54] Abiri A, Paydar O, Genovese B, Khrucharoen U, Candler R, Dutson EP, Grundfest W, "Suture Strength for Robotic Surgery", Society of American Gastrointestinal and Endoscopic Surgeon Conference, 2015 April 15-18, (no proceedings).
[53] (Invited, no proceedings) H. Sohn, M. E. Nowakowski, C.-Y. Liang, S. M. Keller, C. S. Lynch, G. P. Carman, J. Bokor, and R. N. Candler, “TANMS Magnetization Control in Multiferroic Ring Structures”, XXIII International Materials Research Congress, 2014.
[52] J. Harrison, J. Wu, O. Paydar, Y. Hwang, E. Threkleld, J. Rosenzweig, P. Musumeci, R. Candler, “High-Gradient MEMS Electromagnets for Particle Beam Manipulation,” Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2014.
[51] H. Sohn, M. E. Nowakowski, J. Hockel, C. Liang, K. Wetzlar, M. Klaui, C. S. Lynch, G. P. Carman, J. Bokor, R. N. Candler, “Strain-Mediated Electrical Control of Magnetization in Micron-scale Nickel Ring on PMN-PT,” Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2014.
[50] J. Lake, Y. Hwang, E. Ng, C.H.- Ahn, V. Hong, Y. Yang, Y. Dai, R. Candler, “Experimental Validation of 3D Intuitive Modeling Approach for Anchor Loss in MEMS Resonators,” Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2014.
[49] A.J. Chung, C.-Y. Wu, D.E. Go, J.C. Oka, O.H. Paydar, R. Candler, D. Di Carlo, “Complex 3D Shaped Particle Fabrication Via Inertial Flow Deformation and UV Polymerization,” Proceedings of uTAS, 2013.
[48] J. Lake, E. Ng, C.-H. Ahn, V. Hong, Y. Yang, J. Wong, R. N. Candler, “Particle swarm optimization for design of MEMS resonators with low thermoelastic dissipation," Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on , vol., no., pp.1456,1459, 16-20 June 2013
[47] (Invited) R. N. Candler, “CMOS-Compatible Microscale Magnetic Devices,” CMOS Emerging Technologies Research Symposium, (no proceedings), 2013.
[46] (Invited) R. N. Candler, “Microscale Magnetic Flux Sources for Electron Beam Manipulation,” Workshop on Physics and Applications of High Brightness Beams (no proceedings), 2013.
[45] J. Harrison, A. Joshi, Y. Hwang, O. Paydar, J. Lake, P. Musumeci, R. N. Candler, “Surface-micromachined electromagnets for 100 μm-scale undulators and focusing optics,” Physics Procedia, Volume 52, pp. 19-26, 2014.
[44] Y. Hwang, A. Phan, K. Galatsis, O. Yaghi, R. N. Candler, “ZIF-Coupled Microresonator for Highly Sensitive and Selective Gas Detection,” Proceedings of uTAS, pp. 231-233, 2012.
[43] O. H. Paydar, C. R. Wottawa, R. E. Fan, E. P. Dutson, W. S. Grundfest, M. O. Culjat, R. N. Candler, “Fabrication of a Thin-film Capacitive Force Sensor Array for Tactile Feedback in Robotic Surgery,” Proceedings of IEEE Engineering in Medicine and Biology Conference (EMBC), 2012.
[42] S. Iyer, H. Lee, M. Liger, J. Judy, R. N. Candler, “Nonlinear Damping for Shock Protection of MEMS Devices Using Shear Thickening Fluid”, Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2012.
[41] O. H. Paydar, C. N. Paredes, R. N. Candler, “Three Dimensionally-Printed (3DP) Microfluidic Devices”, Proceedings of Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2012.
[40] (Invited) B. Kim, R. Melamud, R. N. Candler, M. A. Hopcroft, T. W., Kenny, “MEMS Packaging for Reliable Resonators and Oscillators”, IMS2012 International Microwave Symposium, 2012.
[39] Y. Hwang, S. Kim, R. N. Candler, “Receptor-Coated Porous Silicon Resonator for Enhanced Sensitivity of Vapor Detection,” Joint Conference of the International Frequency Control Symposium & European Frequency and Time Forum, 2011.
[38] C. N. Paredes, J. Paz, N. Shah, R. N. Candler, “Microfluidic Chip Interconnect for Research and Diagnostics,” presented at LabAutomation2011 (no proceedings), 2011.
[37] G. Hernandez, R. N. Candler, S. Franz, and Y.S. Lin, “High-k Gate Dielectric and Electrical and Surface Studies of Al2O3, HfO2, La2O3, AlxHfyOz, and ZrO2/HfO2 on Silicon via Atomic Layer Deposition,” presented at AVS 57th International Symposium and Exhibition (no proceedings), 2010.
[36] Y. Hwang, F. Gao, and R. N. Candler, “Porous Silicon Resonator for Sensitive Vapor Detection,” Solid State Sensors and Actuators Workshop, Hilton Head, pp. 150-153, 2010.
[35] (Invited) R. N. Candler, Y. Hwang, and F. Gao, “Sensitivity Enhancement of Vapor Sensors with Porous Silicon Resonant Structures,” SPIE Defense, Security, and Sensing, 7679-19, 2010
[34] B. Kim, R. Melamud, R. N. Candler, M. A. Hopcroft, C. Jha, S. Chandorkar, and T. Kenny, "Encapsulated MEMS Resonators - A technology path for MEMS into Frequency Control Applications," IEEE International Frequency Control Symposium, 2010.
[33] C.S. Roper, R. Candler, S. Yoneoka, T. Kenny, R.T. Howe, and R. Maboudian, "Simultaneous Wafer-scale Vacuum Encapsulation and Microstructure Cladding with LPCVD Polycrystalline 3C-SiC," Transducers 2009, pp. 1031-1034, 2009.
[32] M. Weinberg, R. Candler, S. Chandorkar, J. Varsanik, T. Kenny, A. Duwel, "Energy Loss in MEMS Resonators and the Impact of Inertial and RF Devices," Transducers 2009, pp. 688-695, 2009.
[31] S. Yoneoka, G. Bahl, J. Salvia, K. L. Chen, A. B. Graham, H. K. Lee, G. Yama, R. N. Candler, and T. W. Kenny, “Acceleration Compensation of MEMS Resonators Using Electrostatic Tuning,” MEMS09, 2009.
[30] G. Bahl, R. Melamud, B. Kim, S. Chandorkar, J. Salvia, M.A. Hopcroft, R.G. Hennessy, S. Yoneoka, C.M. Jha, G. Yama, D. Elata, R.N. Candler, R.T. Howe, and T.W. Kenny, “Observations of Fixed and Mobile Charge in Composite MEMS Resonators," Solid State Sensors and Actuators Workshop, Hilton Head, 2008.
[29] K. L. Tsai, M. Ziaei-Moayyed, N. Klejwa, R. N. Candler, W. Hu, S. X. Wang, and R. T. Howe, “Characterization of Magnetic Nanoparticle-Embedded SU8 for Microactuation,” Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), 2008.
[28] B. Kim, R. N. Candler, R. Melamud, S. Yoneoka, H. K. Lee, G. Yama, and T. W. Kenny, “Identification and Management of Diffusion Pathways in Polysilicon Encapsulation for MEMS Devices,” MEMS 2008.
[27] S. A. Chandorkar, M. Agarwal, R. Melamud, R. N. Candler, K. E. Goodson, and T. W. Kenny, “Limits of Quality Factor in Bulk-Mode Micromechanical Resonators,” MEMS 2008.
[26] B. Kim, M. Hopcroft, C. M. Jha, R. Melamud, S. Chandorkar, M. Agarwal, K. L. Chen, W. T. Park, R. Candler, G. Yama, A. Partridge, M. Lutz, T. W. Kenny, “Using MEMS to Build the Device and the Package,” Transducers/Eurosensors, 2007.
[25] B. Kim, R. Melamud, M. A. Hopcroft, S. Chandorkar, M. Agarwal, G. Bahl, M. Messana, R. N. Candler, G. Yama, and T. W. Kenny, “Si-SiO2 Composite MEMS Resonator in CMOS Compatible Encapsulation,” presented at IEEE Frequency Control Symposium, 2007.
[24] S. A. Chandorkar, H. Mehta, M. Agarwal, M. A. Hopcroft, C. M. Jha, G. Yama, R. N. Candler, G. Bahl, B. Kim, R. Melamud, K. E. Goodson, and T. W. Kenny, ”Non-isothermal Micromechanical Resonators,” presented at MEMS 2007.
[23] M. Agarwal, H. Mehta, R. N. Candler, G. Yama, S. A. Chandorkar, B. Kim, M. A. Hopcroft, R. Melamud, G. Bahl, T. W. Kenny, and B. Murmann, “Impact of Miniaturization on the Current Handling of Electrostatic MEMS Resonators,” presented at MEMS 2007.
[22] T. W. Kenny, A. Partridge, R. N. Candler, W.-T. Park, M. Hopcroft, B. Kim, M. Agarwal, S. A. Chandorkar, R. Melamud, and C. Jha, "Manufacturable MEMS: Building the MEMS, the Package and the Circuit in the Same Technology," presented at International Forum on Micro-Nano Hetero System Integration in Sendai (MHSI'06), 2006.
[21] T. W. Kenny, M. Lutz, A. Partridge, G. Yama, R. N. Candler, W.-T. Park, M. Hopcroft, B. Kim, M. Agarwal, S. A. Chandorkar, R. Melamud, and C. Jha, "Advances in MEMS Integration: MEMS First or MEMS Last?" presented at 12th International Micromachine/Nanotech Symposium, 2006.
[20] M. Agarwal, K.K. Park, B. Kim, M.A. Hopcroft, S.A. Chandorkar, R.N. Candler, C.M. Jha, R. Melamud, T.W. Kenny, and B. Murmann, “Amplitude Noise Induced Phase Noise In Electrostatic MEMS Resonators”, Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), pp. 90-93, 2006.
[19] M. Agarwal, K.K. Park, R. N. Candler, B. Kim, M. Hopcroft, S. A. Chandorkar, C. M. Jha, R. Melamud, T. W. Kenny, B. Murmann, “Nonlinear Characterization of Electrostatic MEMS Resonators”, IEEE International Frequency Control Symposium, pp. 209-212, 2006.
[18] M. A. Hopcroft, M. Agarwal, K. K. Park, C. M. Jha, R. N. Candler, G. Yama, B. Murmann, T. W. Kenny, “Temperature Compensation of a MEMS Resonator Using Quality Factor as a Thermometer,” MEMS 06, pp. 222-225, 2006.
[17] M. Agarwal, K. Park, M. Hopcroft, R. N. Candler, B. Kim, R. Melamud, G. Yama, B. Murmann, and T. W. Kenny, "Effects of Mechanical Vibrations and Bias Voltage Noise on Phase Noise in MEMS Resonators Based Oscillators," MEMS 06, pp. 154-157, 2006.
[16] B. Kim, C. Jha, T. White, R. N. Candler, M. Hopcroft, M. Agarwal, K. Park, S. A. Chandorkar, and T. W. Kenny, "Temperature Dependence of Quality Factor in MEMS Resonators," MEMS 06, pp. 590-593, 2006.
[15] A. Partridge, M. Lutz, B. Kim, M. Hopcroft, R.N. Candler, T.W. Kenny, K. Petersen, M. Esashi “MEMS Resonators: Getting the Packaging Right,” presented at SEMICON-Japan, 2005.
[14] M. Agarwal, K. Park, R. N. Candler, M. Hopcroft, C. Jha, R. Melamud, B. Kim, B. Murmann, and T. W. Kenny, "Non-Linearity Cancellation in MEMS Resonators for Improved Power Handling," IEEE International Electron Devices Meeting (IEDM), pp. 286-289, 2005.
[13] R. N. Candler, W.-T. Park, M. Hopcroft, B. Kim, and T. W. Kenny, "Hydrogen Diffusion and Pressure Control of Encapsulated MEMS Resonators," Transducers '05, pp. 920-923, 2005.
[12] R. N. Candler, M. Hopcroft, C. W. Low, S. A. Chandorkar, B. Kim, M. Varghese, A. Duwel, and T. W. Kenny, "Impact of Slot Location on Thermoelastic Dissipation in Micromechanical Resonators," Transducers '05, pp. 597-600, 2005.
[11] B. Kim, R. N. Candler, M. Hopcroft, M. Agarwal, W.-T. Park, and T. W. Kenny, "Frequency Stability of Wafer-scale Encapsulated MEMS Resonators," Transducers '05, pp. 1965-1968, 2005.
[10] W.-T. Park, K. N. O'Connor, J. R. Mallon, T. Maetani, R. N. Candler, V. Ayanoor-Vitikkate, J. B. Roberson, S. Puria, and T. W. Kenny, "Sub-mm Encapsulated Accelerometers: A Fully Implantable Sensor for Cochlear Implants," Transducers '05, pp. 109-112, 2005.
[9] R. Melamud, M. Hopcroft, C. Jha, B. Kim, S. A. Chandorkar, R. N. Candler, and T. W. Kenny, "Effects of Stress on the Temperature Coefficient of Frequency in Double Clamped Resonators," Transducers 2005, pp. 392-395, 2005.
[8] W.-T. Park, R. N. Candler, V. Ayanoor-Vitikkate, M. Lutz, A. Partridge, G. Yama, and T. W. Kenny, "Fully Encapsulated Sub-millimeter Accelerometers," MEMS 2005, pp. 347-350, 2005.
[7] B. Kim, R. N. Candler, M. Hopcroft, M. Agarwal, W.-T. Park, J. Li, and T. W. Kenny, "Investigation of MEMS Resonator Characteristics During Long-Term and Wide Temperature Variation Operation," 2004 ASME International Mechanical Engineering Congress and RD&D Expo, pp. 413-416, 2004.
[6] R. N. Candler, M. Hopcroft, W.-T. Park, S. A. Chandorkar, G. Yama, K. E. Goodson, M. Varghese, A. Duwel, A. Partridge, M. Lutz, and T. W. Kenny, "Reduction in Thermoelastic Dissipation in Micromechanical Resonators by Disruption of Heat Transport," Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), pp. 45-48, 2004.
[5] M. Hopcroft, R. Melamud, R. N. Candler, W.-T. Park, B. Kim, G. Yama, A. Partridge, M. Lutz, and T. W. Kenny, "Active Temperature Compensation for Micromachined Resonators," Solid State Sensors, Actuators, and Microsystems Workshop (Hilton Head), pp. 364-367, 2004.
[4] W.-T. Park, R. N. Candler, A. Partridge, G. Yama, M. Lutz, and T. W. Kenny, "Wafer Scale Encapsulation of MEMS Devices," Proceedings of INTERPACK'03 The Pacific RIM/ASME International Electronic Packaging Technical Conference and Exhibition, 2003.
[3] R. N. Candler, H. Li, M. Lutz, W.-T. Park, A. Partridge, G. Yama, and T. W. Kenny, "Investigation of Energy Loss Mechanisms in Micromechanical Resonators," Transducers '03, vol. 1, pp. 332-335, 2003.
[2] W.-T. Park, R. N. Candler, S. Kronmueller, M. Lutz, A. Partridge, G. Yama, and T. W. Kenny, "Wafer-Scale Film Encapsulation of Micromachined Accelerometers," Transducers '03, vol. 2, pp. 1903 - 1906, 2003.
[1] T. W. Kenny, R. N. Candler, H. Li, W.-T. Park, J. Cho, A. Partridge, G. Yama, and M. Lutz, "An Integrated Wafer-Scale Packaging Process for MEMS," ASME International Mechanical Engineering Congress and Exposition (IMECE ’02), vol. 2, 2002.
Book Chapters
[4] R. N. Candler and P. Hagelin, editors A. Lehto and H. Kuisma, Chapter 35, Encapsulation by Film Deposition in “Handbook of Silicon Based MEMS Materials and Technologies (2nd edition),” William Andrew Publishing/Elsevier, pp. 664-669, 2015.
[3] J. Lake and R. N. Candler (2014), Theory and Engineering of Micro-scale Resonators with Low Thermoelastic Dissipation, In Hetnarski RB (Ed.) Encyclopedia of Thermal Stresses, Vol 1, pp. 4826 – 4836. Springer Dordrecht, Heidelberg, New York, London.
[2] B. Kim, M. A. Hopcroft, R. N. Candler, “Silicon MEMS Resonators for TIming Applications,” Bentham Science Publishing, CRC Press Taylor and Francis Group, pp. 79-108, 2012.
[1] R. N. Candler, editors A. Lehto and H. Kuisma, Chapter 38, Encapsulation by Film Deposition in “Handbook of Silicon Based MEMS Materials and Technologies,” William Andrew Publishing/Elsevier, pp. 569-574, 2010.
Patents
[6] Y. E. Wang, G. P. Carman, R. N. Candler, S. Keller, “Bulk Acoustic Wave Mediated Multiferroic Antennas,” patent # 10,218,072.
[5] R. N. Candler, “Method of accurately spacing Z-axis electrode,” patent #8,430,255, 2013.
[4] R. N. Candler, G. Yama, “Substrate with Multiple Encapsulated Pressures,” patent #7,875,482, 2011.
[3] Z. Pan, R. N. Candler, M. Lutz, A. Partridge, G. Yama, “Multi-Ring Resonator System and Method,” patent #7,750,758, 2010.
[2] I. Kozinsky, B. Stark, R. N. Candler, “Passive self-tuning resonator system”, patent #7,626,316, 2009.
[1] Z. Pan, R. N. Candler, M. Lutz, A. Partridge, V. Materna, G. Yama, and W. Frey, “In-plane mechanically coupled microelectromechanical tuning fork resonators,” patent #7,319,372, 2008.